ELECTRONIC DEVICE AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide an electronic device that eliminates the need to change a mold for mold formation according to each weld, and to provide its manufacturing method.SOLUTION: An electronic device comprises: a wiring board 10; an electronic element 20 mounted on the principal surface 10...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	NAGASE NOBORU, NAGATANI TOSHIHIRO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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