ELECTRONIC DEVICE AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide an electronic device that eliminates the need to change a mold for mold formation according to each weld, and to provide its manufacturing method.SOLUTION: An electronic device comprises: a wiring board 10; an electronic element 20 mounted on the principal surface 10a of the wiring board; a weld part 30 mounted on the principal surface and welded and joined to an external member 200; and a mold resin 40 covering and protecting the principal surface side of the wiring board. A through-hole 14 is formed in the wiring board. The weld part has: an annular part 31 forming an annular shape and connected to the principal-surface-side edge of the through-hole over the entire circumference; and a columnar part 32 which forms a columnar shape and extends from an area surrounded by the annular part, and the leading end 32c of the first end part 32a out of the two end parts 32a, 32b of which is provided in the through-hole.SELECTED DRAWING: Figure 1 【課題】モールド成形するための金型を接合部に応じて変更しなくともよい電子装置、および、その製造方法を提供する。【解決手段】配線基板１０と、配線基板の主面１０ａに搭載される電子素子２０と、主面に搭載され、外部部材２００と溶接接合される接合部３０と、配線基板の主面側を被覆保護するモールド樹脂４０と、を有し、配線基板には貫通孔１４が形成され、接合部は、環状を成して貫通孔の主面側の縁部と全周にわたって接続される環状部３１と、柱状を成して環状部によって囲まれた領域から延び、２つの端部３２ａ，３２ｂの内の一方の第１端部３２ａの先端３２ｃが貫通孔内に設けられる柱状部３２と、を有する。【選択図】図１