SURFACE TENSION SOLDER POT FOR FEEDING THREAD SOLDER
PROBLEM TO BE SOLVED: To solve a problem of solder spilling out which may occur when a solder part is horizontally immersed in a molten solder in a conventional pot method.SOLUTION: A solder pot is configured to have a shape not allowing a molten solder to spill out owing to surface tension when not...
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Format: | Patent |
Sprache: | eng ; jpn |
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Zusammenfassung: | PROBLEM TO BE SOLVED: To solve a problem of solder spilling out which may occur when a solder part is horizontally immersed in a molten solder in a conventional pot method.SOLUTION: A solder pot is configured to have a shape not allowing a molten solder to spill out owing to surface tension when not only oriented in a horizontal direction but also inclined from the horizontal direction to upward, or from the horizontal direction to downward. In addition, thread solder of every used amount of solder is fed.SELECTED DRAWING: Figure 1
【課題】 半田付け部分を水平方向で溶融半田に浸漬したいとき、ポッド方式ではこぼれ出す問題があった。【解決手段】 水平方向または水平〜上方、水平〜下方に傾けても溶融半田が表面張力によってこぼれ出さない形状を見出し、使用した半田分を都度、糸半田で補給する。【選択図】図1 |
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