PCB TREATMENT METHOD
PROBLEM TO BE SOLVED: To provide a PCB treatment method that can enhance treatment efficiencies in plasma treatment with a simple method.SOLUTION: The PCB treatment method comprises: a cutting step of cutting an electric apparatus having a transformation portion and a capacitor containing PCB while...
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Format: | Patent |
Sprache: | eng ; jpn |
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Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a PCB treatment method that can enhance treatment efficiencies in plasma treatment with a simple method.SOLUTION: The PCB treatment method comprises: a cutting step of cutting an electric apparatus having a transformation portion and a capacitor containing PCB while leaving a capacitor region including the whole of the capacitor; a fracturing step of fracturing a region other than the capacitor region; a magnetically separating step of magnetically separating matter fractured in the fracturing step into magnetic matter and non-magnetic matter; and a melting step of melting the capacitor region and the non-magnetic matter separated in the magnetically separating step by being subjected to plasma treatment.SELECTED DRAWING: Figure 7
【課題】簡便な方法でプラズマ処理の処理効率を高めることのできるPCB処理方法を提供する。【解決手段】変圧部とPCBが含まれるコンデンサとを有する電気機器を、コンデンサ全体が含まれるコンデンサ領域を残存させた状態で切断する切断工程と、コンデンサ領域以外の領域を破砕する破砕工程と、破砕工程で破砕された破砕物を、磁性物と非磁性物とに選別する磁選工程と、コンデンサ領域と、磁選工程で選別された非磁性物とをプラズマ処理して溶融分解する分解工程と、を備えている。【選択図】図7 |
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