SPUTTERING TARGET ASSEMBLY

PROBLEM TO BE SOLVED: To provide a sputtering target not causing peeling between the target and a backing plate during a sputtering operation.SOLUTION: A sputtering target assembly integrated with a sputtering target 1 and a backing plate 2, the sputtering target 1 being formed into a circular or re...

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Bibliographische Detailangaben
Hauptverfasser:	UNNO TAKAHIRO, SHIBAYAMA TAKASANE
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a sputtering target not causing peeling between the target and a backing plate during a sputtering operation.SOLUTION: A sputtering target assembly integrated with a sputtering target 1 and a backing plate 2, the sputtering target 1 being formed into a circular or rectangular shape in a plane view and having a side plane composed of an inclined plane 1c expanding from a first plane 1a to a second plane 1b, and the backing plate 2 having a through hole 2a to which the sputtering target 1 is engaged in. The backing plate 1 holds a side plane of the sputtering target 1 by engaging the sputtering target 1 to the through hole 2a of the backing plate 2.SELECTED DRAWING: Figure 2 【課題】スパッタリング動作中に、ターゲットとバッキングプレートとが剥離することのないスパッタリングターゲットを提供する。【解決手段】スパッタリングターゲット１とバッキングプレート２が一体化したスパッタリングターゲット組立体において、平面視上円形又は矩形に形成され、かつ、第１の面１ａから第２の面１ｂに向けて拡がる傾斜面１ｃからなる側面を有するスパッタリングターゲット１と、前記スパッタリングターゲット１が嵌合する貫通穴２ａを有するバッキングプレート２と、を備え、前記スパッタリングターゲット１をバッキングプレート２の貫通穴２ａに嵌合させることにより、前記バッキングプレート１がスパッタリングターゲット１の側面を保持する。【選択図】図２