VACUUM LAMINATION METHOD

PROBLEM TO BE SOLVED: To provide a vacuum lamination method capable of stably manufacturing a laminate without causing displacement caused by air flow of exhaust air on a substrate passing with substrate conveyance means when a space for decompression of vacuum integration means is exhausted.SOLUTIO...

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Bibliographische Detailangaben
Hauptverfasser: HOMMA YOSHIAKI, FUKUDA HIRONORI, FUKUDA SEIYA, IWATA KAZUTOSHI
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a vacuum lamination method capable of stably manufacturing a laminate without causing displacement caused by air flow of exhaust air on a substrate passing with substrate conveyance means when a space for decompression of vacuum integration means is exhausted.SOLUTION: A vacuum lamination method includes: a workpiece conveyance step (A) of conveying a workpiece W where a resin film is mounted on a substrate while sandwiching the workpiece W between films F and F'; and a vacuum lamination step (B) having vacuum integration means of pressing the workpiece W while sandwiching the workpiece W between a pair of pressing bodies in a decompressed state, and bringing the resin film in close contact with the surface of the substrate, and decompression means containing a vacuum source for decompressing a space between the pair of pressing bodies, where decompression speed control means 50 for adjusting a flow rate of air sucked by a vacuum pump P is interposed and arranged between the vacuum pump P and a vacuum integration device 20 in the vacuum lamination step, and the speed of vacuuming of the space in the periphery of the workpiece by the decompression means can be adjusted.SELECTED DRAWING: Figure 3 【課題】真空一体化手段の減圧用空間内を排気する際も、基板搬送手段によりその中を通過する基板に、排気の気流に起因する位置ずれが発生せず、積層体を安定して製造することのできる真空積層方法を提供する。【解決手段】基板の上に樹脂フィルムが載置されたワークWを搬送用フィルムF,F'の間に挟んで搬送するワーク搬送工程(A)と、ワークWを減圧状態で一対の押圧体の間に挟んで加圧し上記樹脂フィルムを基板表面に密着させる真空一体化手段、および、上記一対の押圧体の間の空間を減圧するための真空源を含む減圧手段を有する真空積層工程(B)を備え、上記真空積層工程における真空ポンプPと真空一体化装置20との間に、真空ポンプPが吸引する空気の流量を調節する減圧速度制御手段50が介在配置され、上記減圧手段によるワーク周囲の空間の真空引きの速度が調節可能になっている。【選択図】図3