GROUND SURFACE COOLING STRUCTURE

PROBLEM TO BE SOLVED: To provide a ground surface cooling structure that can cool the ground surface with poor thermal conductivity sufficiently and evenly without causing failures on the ground surface as much as possible.SOLUTION: A ground surface cooling structure of the present invention includes a surface layer 1 becoming the ground surface and a cooling layer 2 disposed right under the surface layer 1. The ground surface cooling structure is configured such that the thermal conductivity of the surface layer 1 is 0.05-0.5 W/m K, the cooling layer 2 is provided with multiple cooling pipes 10 disposed at regular intervals, and has an operation of cooling the surface layer 1 by making a coolant liquid 50 flow in the cooling pipes 10. When the thickness of the surface layer 1 is t [mm] and the interval of adjacent cooling pipes 10, 10 is d [mm] in the cooling layer 2, the relationship of d≤-4t+205 (1) and d≤5.9t+15.5 (2) is satisfied together.SELECTED DRAWING: Figure 1 【課題】地表面にできるだけ不具合を生じさせることなく、熱伝導率が悪い地表面を十分にかつムラなく冷却することのできる地表面冷却構造を提供する。【解決手段】本発明の地表面冷却構造は、地表面となる表層１と、表層１の直下に配置された冷却層２とを備える地表面冷却構造であって、表層１の熱伝導率が０．０５〜０．５Ｗ／ｍ・Ｋであり、冷却層２は、複数の冷却管１０が一定の間隔で配設され、冷却管１０内に冷媒液５０を流すことによって表層１を冷却する作用を有するものであり、表層１の厚みをｔ［ｍｍ］とし、冷却層２において隣り合う冷却管１０，１０の間隔をｄ［ｍｍ］とするとき、ｄ≦−４ｔ＋２０５ （１）ｄ≦５．９ｔ＋１５．５ （２）の関係をともに満たす。【選択図】図１