LAMINATING APPARATUS AND LAMINATING METHOD

PROBLEM TO BE SOLVED: To provide a laminating apparatus by which a resin film can be made to completely follow irregularities on a substrate even if the irregularities on the substrate have pointed parts, and to provide a laminating method.SOLUTION: A laminating apparatus comprises: conveying means for conveying a temporal laminate 3, in which the temporal laminate consists of a substrate having irregularities and a resin film made from a thermosetting resin in a B-stage state and placed on the irregular surface of the substrate; sealed space-forming means for accommodating the conveyed temporal laminate 3; negative pressure-forming means for generating a negative pressure in a sealed space formed by the sealed space forming means; and heating means for heating the temporal laminate 3 from the substrate side thereof, in the sealed space in the negative pressure state, to soften the resin film. The sealed space in the negative pressure state is set to ambient pressure or is pressurized, and the resin film which has been softened in a contactless state is caused to adhere along the irregularities of the substrate to form a final laminate 4 from the temporal laminate 3.SELECTED DRAWING: Figure 1 【課題】基材の凹凸として尖った部分を有するものに対しても、樹脂フィルムを基材の凹凸に完全に追従させることができる積層装置および積層方法を提供する。【解決手段】凹凸を有する基材のその凹凸面にＢステージ状態の熱硬化性樹脂からなる樹脂フィルムを載置した仮積層体３を搬送する搬送手段と、搬送された仮積層体３を収容する密閉空間形成手段と、上記密閉空間形成手段によって形成された密閉空間を負圧にする負圧形成手段と、上記負圧状態の密閉空間において仮積層体３を基材側から加熱し、樹脂フィルムを軟化する加熱手段と、上記負圧状態の密閉空間を常圧または加圧にし、非接触状態で上記軟化した樹脂フィルムを基材の凹凸に沿わせて密着させ上記仮積層体３から本積層体４を形成するようにした。【選択図】図１