POLISHING DEVICE

PROBLEM TO BE SOLVED: To provide a polishing device which maintains high polishing accuracy regardless of a polished portion of a polished material.SOLUTION: The invention relates to a polishing device including: a holding part capable of holding a polished material; a polishing body for polishing t...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KATO SATORU, UCHIMURA HIROSHI, OMAGARI HIROAKI
Format: Patent
Sprache:eng ; jpn
Schlagworte:
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a polishing device which maintains high polishing accuracy regardless of a polished portion of a polished material.SOLUTION: The invention relates to a polishing device including: a holding part capable of holding a polished material; a polishing body for polishing the polished material held by the holding part; a polishing body support assembly which supports the polishing body through an elastic mechanism; a device body which supports the polishing body support assembly through a driving mechanism which moves the polishing body support assembly relative to the polished material; and a linear motor capable of driving the polishing body relative to the polishing body support assembly.SELECTED DRAWING: Figure 1 【課題】被研磨材の研磨部位によらずに、高い研磨精度を維持することが可能な研磨装置を提供すること。【解決手段】本発明は、被研磨材を保持可能な保持部と、前記保持部に保持された被研磨材を研磨するための研磨体と、弾性機構を介して前記研磨体を支持する研磨体支持アセンブリと、前記研磨体支持アセンブリを前記被研磨材に対して相対移動させる駆動機構を介して当該研磨体支持アセンブリを支持する装置本体と、前記研磨体を前記研磨体支持アセンブリに対して駆動可能なリニアモータと、を備えたことを特徴する研磨装置である。【選択図】図1