METHOD FOR CORRECTING MOVABLE HEAD POSITION OF X-Y SUBSTRATE INSPECTION DEVICE, AND X-Y SUBSTRATE INSPECTION DEVICE

PROBLEM TO BE SOLVED: To provide a method for correcting the movable head position of an X-Y substrate inspection device for correcting displacement in the amount of movement of a ball screw due to change in temperature of the ball screw in X-Y substrate inspection devices using a ball screw, and also to provide an X-Y substrate inspection device.SOLUTION: Reference mark sequences 22 and 23 with known coordinate positions are installed in the X axis direction and the Y axis direction. An X-axis drive unit 10 and a Y-axis drive unit are driven, and a movable head 17 is moved to reference mark positions in the X axis direction and the Y axis direction. The reference mark sequences 22 and 23 are photographed at the positions after movement, the amount of displacement of the positions after movement from the reference mark sequences 22 and 23 is detected, and command values given to the X-axis drive unit 10 and the Y-axis drive unit are corrected on the basis of the detected amount of displacement.SELECTED DRAWING: Figure 1 【課題】ボールネジを用いたＸ−Ｙ基板検査装置において、ボールネジの温度変化によってボールネジの移動量にずれを補正するＸ−Ｙ基板検査装置の可動ヘッド位置補正方法およびＸ−Ｙ基板検査装置を提供する。【解決手段】Ｘ軸方向およびＹ軸方向に座標位置が既知の基準マーク列２２、２３を設置し、Ｘ軸駆動ユニット１０およびＹ軸駆動ユニットを駆動して、可動ヘッド１７をＸ軸方向およびＹ軸方向の基準マーク位置に移動させ、移動した位置で基準マーク列２２、２３を撮像し、移動した位置の基準マーク列２２、２３からのずれ量を検出して、検出したずれ量に基づいてＸ軸駆動ユニット１０およびＹ軸駆動ユニットに与える指令値を補正する。【選択図】図１