RESIN COMPOSITION, RESIN SHEET, RESIN CURED ARTICLE, AND RESIN SUBSTRATE

PROBLEM TO BE SOLVED: To provide a resin composition capable of providing excellent thermal characteristics.SOLUTION: A resin composition contains an epoxy compound and a triphenyl benzene compound. The triphenyl benzene compound is a compound containing 1,3,5-triphenyl benzene as a skeleton and rea...

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Bibliographische Detailangaben
Hauptverfasser:	EBISAWA AKIRA, HARAI TOMOYUKI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a resin composition capable of providing excellent thermal characteristics.SOLUTION: A resin composition contains an epoxy compound and a triphenyl benzene compound. The triphenyl benzene compound is a compound containing 1,3,5-triphenyl benzene as a skeleton and reactive groups introduced to the skeleton. The total number of the reactive groups is 4 or more and 6 or less. 【課題】優れた熱的特性を得ることが可能な樹脂組成物を提供する。【解決手段】樹脂組成物は、エポキシ化合物と、トリフェニルベンゼン化合物とを含む。このトリフェニルベンゼン化合物は、骨格として１，３，５−トリフェニルベンゼンを含むと共にその骨格に反応基が導入された化合物である。ただし、反応基の総数は、４つ以上６つ以下である。