METHOD FOR MANUFACTURING CURABLE RESIN COMPOSITION

PROBLEM TO BE SOLVED: To provide a method for stably mixing a curable resin composition whereby, when manufacturing a composition by using a resin for a semiconductor package, which requires heat resistance and light resistance and cures by a hydrosilyl reaction or the like, it is possible to prevent the occurrence of residence caused by the curable resin composition to be wound on or caught in a mixing wing during mixing.SOLUTION: There is provided a manufacturing method of a curable resin composition containing (A) a curable resin, (B) a white resin and (C) an inorganic filler as essential components, including mixing with a mixer, where a mixing wing with two shafts revolves and each shaft rotates independently, two shafts rotate in different directions respectively and two shaft mixing wing shapes have different shapes, one shape of the mixing wing is a screw beater shape and another is a screw hook shape and thickness of the mixing wing is 30 mm or more.SELECTED DRAWING: None 【課題】半導体パッケージ用様の樹脂であり耐熱性・耐光性が求められ、ヒドロシリル反応等により硬化する樹脂を用いて、組成物を製造するとき、混練中に混練翼に硬化性樹脂組成物が巻き付いたり、挟ったりして、滞留が生じない硬化性樹脂組成物を安定的に混練する方法の提供。【解決手段】（A）硬化性樹脂、（B）白色顔料、（C）無機充填剤を必須成分として含有する硬化性樹脂組成物であり、二軸の混練翼が公転し、かつ各軸それぞれが自転を伴う混練機で、二軸それぞれが異方向の自転をし、二軸の混練翼形状がそれぞれ異なる形状で混練し、混練翼の一つの形状がスクリュビーターの形状であり、もう一方がスクリューフック形状であり、前記混練翼の太さが30mm以上である硬化性樹脂組成物の製造方法。【選択図】なし