COOLING POWER CONVERSION ASSEMBLY

PROBLEM TO BE SOLVED: To provide a cooling power conversion assembly having simple cooling means.SOLUTION: A cooling power conversion assembly comprises: a first chamber 100; a second chamber 200 at least partially separated from the first chamber 100; at least one first type device 1 located in the...

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Bibliographische Detailangaben
Hauptverfasser:	JANI KANGAS, JUHA HAMARI, MIKKO MYLLER, DAN MILLNER
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONTROL OR REGULATION THEREOF CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER CONVERSION OR DISTRIBUTION OF ELECTRIC POWER DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERATION HEAT EXCHANGE IN GENERAL HEATING LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PRINTED CIRCUITS WEAPONS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a cooling power conversion assembly having simple cooling means.SOLUTION: A cooling power conversion assembly comprises: a first chamber 100; a second chamber 200 at least partially separated from the first chamber 100; at least one first type device 1 located in the first chamber 100; at least one second type device 2 located in the second chamber 200; and cooling means comprising a first cooling element 3 and a second cooling element 4. The first cooling element 3 is adapted to transfer heat from the first chamber 100 to the outside, and the second cooling element 4 is adapted to transfer heat from the second chamber 200 to the outside. The first cooling element 3 is in direct contact with the at least one first type device 1, and the second cooling element 4 is in a heat transfer connection with the at least one second type device 2 through a gaseous cooling medium.SELECTED DRAWING: Figure 1 【課題】単純な冷却手段を有する冷却式電力変換アセンブリを提供すること。【解決手段】第１のチャンバ１００と、第１のチャンバ１００から少なくとも部分的に分離された第２のチャンバ２００と、第１のチャンバ１００内に配置された少なくとも１つの第１の型のデバイス１と、第２のチャンバ２００内に配置された少なくとも１つの第２の型のデバイス２と、第１の冷却素子３及び第２の冷却素子４を備える冷却手段と、を備える冷却式電力変換アセンブリ。第１の冷却素子３は、第１のチャンバ１００から外に熱を伝達するように適合され、第２の冷却素子４は、第２のチャンバ２００から外に熱を伝達するように適合される。第１の冷却素子３は、少なくとも１つの第１の型のデバイス１と直接接触しており、第２の冷却素子４は、少なくとも１つの第２の型のデバイス２と気体冷却媒体を通して熱伝達的に接続している。【選択図】図１