SMALL CAPACITY CARRIER TRANSPORTING BODY, LOAD PORT, AND BUFFER SYSTEM

PROBLEM TO BE SOLVED: To provide a semiconductor work-piece processing system.SOLUTION: A semiconductor work-piece processing system comprises: at least one processing apparatus for processing work-pieces; a first transport system; a second transport system; and one or more interfaces between the fi...

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Bibliographische Detailangaben
Hauptverfasser:	MICHAEL L BUCHANAN, CHRISTOPHER HOFMEISTER, WILLIAM FOSNIGHT, GILCHRIST ULYSSES
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a semiconductor work-piece processing system.SOLUTION: A semiconductor work-piece processing system comprises: at least one processing apparatus for processing work-pieces; a first transport system; a second transport system; and one or more interfaces between the first transport system and the second transport system. Each of the first transport system and the second transport system comprises one or more sections having substantially constant velocity and communicates with constant velocity sections in queue sections.SELECTED DRAWING: Figure 34 【課題】半導体被加工物処理システムを提供する。【解決手段】半導体被加工物処理システムは、処理被加工物のための少なくとも１つの処理装置と、第１搬送システムと、第２搬送システムと、第１搬送システムと第２搬送システムとの間における１つ以上のインターフェースと、を有し、第１搬送システムと第２搬送システムの各々が、実質的に等速度である１つ以上のセクションを有し、キュー部において等速度セクションに通じている。【選択図】図３４