MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To improve the producibility of a semiconductor device.SOLUTION: A manufacturing method of a semiconductor device includes the steps of: (a) forming a circuit on a surface 1t side of a wafer (semiconductor wafer) 10 having the surface 1t and a rear surface on the side opposite to the surface 1t; (b) grinding the rear surface of the wafer 10 having a central part (first portion) 11 and a peripheral part 12 (second portion) surrounding the periphery of the central part 11 so that a thickness of the central part 11 becomes thinner than a thickness of the peripheral part 12; (c) sticking an upper surface (adhesive surface) 31t of a holding tape 31 to the surface 1t of the wafer 10; and (d) cutting a portion of the central part 11 into the central part 11 and the peripheral part 12 with a blade (rotary blade) 36 in the state where the wafer 10 is held by the first tape.SELECTED DRAWING: Figure 19 【課題】半導体装置の製造効率を向上させる。【解決手段】半導体装置の製造方法は、以下の工程を含んでいる。（ａ）表面１ｔ、表面１ｔの反対側の裏面を有するウエハ（半導体ウエハ）１０の表面１ｔ側に回路を形成する工程。（ｂ）中央部（第１部分）１１、および中央部１１の周囲を囲む周縁部１２（第２部分）を有するウエハ１０の裏面を、中央部１１の厚さが周縁部１２の厚さよりも薄くなるように研削する工程。（ｃ）保持テープ３１の上面（接着面）３１ｔをウエハ１０の表面１ｔに貼り付ける工程。（ｄ）ウエハ１０が上記第１テープに保持された状態で、ブレード（回転刃）３６により中央部１１の一部を切断し、中央部１１と周縁部１２とに切り分ける工程。【選択図】図１９