COMPOSITION FOR ELECTRODE FORMATION, ELECTRODE, SOLAR CELL ELEMENT, METHOD OF MANUFACTURING THE SAME, AND SOLAR CELL

PROBLEM TO BE SOLVED: To provide a composition for electrode formation capable of forming an electrode containing copper having low resistivity and excellent ohmic contact with a semiconductor substrate.SOLUTION: A composition for electrode formation is constituted by including: phosphorus-containin...

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Hauptverfasser:	NEMOTO SATOMI, NOJIRI TAKESHI, MACHII YOICHI, ADACHI SHUICHIRO, YOSHIDA MASATO, KURATA YASUSHI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ALLOYS BASIC ELECTRIC ELEMENTS CABLES CASTING CHEMISTRY CONDUCTORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS INSULATORS MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER METALLURGY PERFORMING OPERATIONS POWDER METALLURGY SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SEMICONDUCTOR DEVICES TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WORKING METALLIC POWDER
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a composition for electrode formation capable of forming an electrode containing copper having low resistivity and excellent ohmic contact with a semiconductor substrate.SOLUTION: A composition for electrode formation is constituted by including: phosphorus-containing copper alloy particles; metal particles including tin-containing particles and nickel-containing particles; and glass particles. When the content of metal particles is 100.0 mass%, the content of copper is 60.0 to 95.0 mass%.SELECTED DRAWING: None 【課題】抵抗率が低く、半導体基板との良好なオーミックコンタクトを有する銅含有電極を形成可能な電極形成用組成物を提供する。【解決手段】電極形成用組成物を、リン含有銅合金粒子、錫含有粒子及びニッケル含有粒子を含む金属粒子と、ガラス粒子と、を含有して構成し、金属粒子の含有率を１００．０質量％としたときの銅含有率が６０．０質量％〜９５．０質量％である。【選択図】なし