ELECTRODE-FORMING COMPOSITION, ELECTRODE, SOLAR CELL ELEMENT AND METHOD FOR PRODUCING THE SAME, AND SOLAR CELL

PROBLEM TO BE SOLVED: To provide an electrode-forming composition that can form a copper-containing electrode having a low resistivity, having excellent ohmic contact with a semiconductor substrate, and further having excellent adhesion to the semiconductor substrate.SOLUTION: An electrode-forming c...

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Bibliographische Detailangaben
Hauptverfasser:	NEMOTO SATOMI, NOJIRI TAKESHI, MACHII YOICHI, ADACHI SHUICHIRO, KURATA YASUSHI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ALLOYS BASIC ELECTRIC ELEMENTS CABLES CASTING CHEMISTRY CONDUCTORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS INSULATORS MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER METALLURGY PERFORMING OPERATIONS POWDER METALLURGY SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SEMICONDUCTOR DEVICES TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WORKING METALLIC POWDER
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Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an electrode-forming composition that can form a copper-containing electrode having a low resistivity, having excellent ohmic contact with a semiconductor substrate, and further having excellent adhesion to the semiconductor substrate.SOLUTION: An electrode-forming composition comprises metal particles comprising phosphorus-tin-nickel containing copper alloy particles, and glass particles, where in a particle size distribution of the phosphorus-tin-nickel containing copper alloy particles, a particle diameter (D50%) corresponding to a 50% volume cumulative value from a smaller diameter side is 1.0 μm-9.0 μm.SELECTED DRAWING: None 【課題】抵抗率が低く、半導体基板との良好なオーミックコンタクトを有し、更に半導体基板との密着力に優れた銅含有電極を形成可能な電極形成用組成物の提供。【解決手段】リン−錫−ニッケル含有銅合金粒子を含む金属粒子と、ガラス粒子と、を含み、前記リン−錫−ニッケル含有銅合金粒子の粒度分布において小径側からの体積累積５０％に対応する粒子径（Ｄ５０％）が１．０μｍ〜９．０μｍである、電極形成用組成物。【選択図】なし