MANUFACTURING METHOD OF VAPOR-DEPOSITED FILM

PROBLEM TO BE SOLVED: To provide a method of reducing a risk of damaging to a film surface by suppressing an abnormal discharge such as an arc discharge, as well as improving adhesion between a substrate film and a vapor deposition layer in performing a plasma treatment on the substrate film.SOLUTIO...

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Bibliographische Detailangaben
1. Verfasser: KOMORI TSUNENORI
Format: Patent
Sprache:eng ; jpn
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