MANUFACTURING METHOD OF VAPOR-DEPOSITED FILM
PROBLEM TO BE SOLVED: To provide a method of reducing a risk of damaging to a film surface by suppressing an abnormal discharge such as an arc discharge, as well as improving adhesion between a substrate film and a vapor deposition layer in performing a plasma treatment on the substrate film.SOLUTIO...
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Format: | Patent |
Sprache: | eng ; jpn |
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