DIE, METHOD FOR CONTROLLING DIE, AND SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a die improved in releasability by a simple structure, a method for controlling the die, and a semiconductor device produced by the die.SOLUTION: Provided is a die 10 comprising: a first die 20 having a first cavity 21 of forming a first sealing part 5; and a second die 40 having a second cavity 41 of forming a second sealing part 6.The first die 20 includes: at least either a first pin 22 applied when the first sealing part 5 is released from the first die 20 or a first runner pin 32 applied when a runner molding 4r formed at a runner part 13 is released from the first die 20; at least either a first pin passage 24 arranged in combination with the first pin 22 or a first runner pin passage 34 arranged in combination with the first runner pin 32; and a gas introduction part 29 of introducing a compressed gas GS to at least either the first pin passage 24 or the first runner pin passage 34.SELECTED DRAWING: Figure 6 【課題】簡潔な構造で、離型性を向上させた金型、金型の制御方法、金型により製造される半導体装置を提供する。【解決手段】金型１０は、第１封止部５を形成する第１キャビティ２１を有する第１金型２０と、第２封止部６を形成する第２キャビティ４１を有する第２金型４０と、を備える。第１金型２０は、第１封止部５を第１金型２０から離すときに適用される第１ピン２２、またはランナー部１３に形成されたランナー成形体４ｒを第１金型２０から離すときに適用される第１ランナーピン３２の少なくとも一方と、第１ピン２２に併せて配置される第１ピン通路２４、または第１ランナーピン３２に併せて配置される第１ランナーピン通路３４の少なくとも一方と、第１ピン通路２４、または第１ランナーピン通路３４の少なくとも一方へ圧縮気体ＧＳを導く気体導入部２９と、を備える。【選択図】図６