CLEANING SPONGE

PROBLEM TO BE SOLVED: To provide a cleaning sponge capable of cleaning an entire surface of a wafer.SOLUTION: A cleaning sponge 1 includes a columnar sponge material 2 having a rotary shaft 3 at a center O and further includes slits 4 along a circumferential direction of an outer peripheral surface 2a of the sponge material 2. The structure allows the cleaning sponge 1 to press the sponge material 2 against a lower surface Wa of a wafer W with a small pressing force which does not hinder rotation of the wafer W and clean the lower surface Wa in a state where an outer peripheral edge Wc of the wafer W is rotatably held by wafer rotation means 5. Thus, the cleaning sponge 1 efficiently cleans the entire lower surface Wa of the wafer W. Further, in a case that an upper surface Wb of the wafer W is cleaned with, for example, a water pressure of a cleaning water nozzle concurrently with cleaning the lower surface Wa of the wafer W with the cleaning sponge 1, the cleaning sponge 1 efficiently cleans the entire lower surface Wa of the wafer W without hindering rotation of the wafer W.SELECTED DRAWING: Figure 1 【課題】ウエーハの面の全面を洗浄できる洗浄スポンジを提供する。【解決手段】洗浄スポンジ１は、中心Ｏに回転軸３を有する円柱状のスポンジ材２を備え、スポンジ材２の外周面２ａの周方向に沿って複数のスリット４を備えるため、ウエーハ回転手段５によってウエーハＷの外周縁Ｗｃを回転可能に把持した状態のままで、ウエーハＷの回転の妨げにならない程度の小さい押圧力でスポンジ材２をウエーハＷの下面Ｗａに押し当てて洗浄することができる。よって、ウエーハＷの下面Ｗａの全面を効率よく洗浄することができる。また、洗浄スポンジ１でウエーハＷの下面Ｗａを洗浄すると同時に、ウエーハＷの上面Ｗｂを例えば洗浄水ノズルの水圧で洗浄する場合も、ウエーハＷの回転を妨げずにウエーハＷの下面Ｗａの全面を効率よく洗浄できる。【選択図】図１