PHOTOSENSITIVE RESIN COMPOSITION, RESIN FILM AND ELECTRONIC DEVICE

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition allowing stable manufacture of an electronic device while having excellent low-temperature curing property.SOLUTION: The photosensitive resin composition comprises an alkali-soluble resin (A) and a crosslinking agent (B) comprising a compound having a block isocyanate group. The photosensitive resin composition has such properties that, when the composition is dissolved in an organic solvent (C) to have a solid content of 50 mass% to obtain a varnish-like photosensitive resin composition, which is further dried under the conditions of 80°C for 90 seconds to remove the organic solvent (C) to obtain a resin film (a), and then the resin film (a) is heat treated in a nitrogen atmosphere under the conditions of 220°C for 90 minutes, the obtained resin film (b) has a glass transition temperature of 150°C or higher.SELECTED DRAWING: None 【課題】低温硬化特性に優れながら、安定的な電子装置の製造が実現できる感光性樹脂組成物の提供。【解決手段】アルカリ可溶性樹脂（Ａ）と、ブロックイソシアネート基を有する化合物を含む架橋剤（Ｂ）とを含み、さらに固形分量５０質量％となるように有機溶媒（Ｃ）に溶解して得たワニス状感光性樹脂組成物に対して８０℃、９０秒の条件下で上記有機溶剤（Ｃ）を乾燥して樹脂膜ａを得た後、上記樹脂膜ａに対して窒素雰囲気下、２２０℃、９０分の条件で加熱処理を施して得られる樹脂膜ｂのガラス転移温度が１５０℃以上である感光性樹脂組成物。【選択図】なし