CURABLE SILICONE RESIN COMPOSITION AND CURED PRODUCT OF THE SAME, AND OPTICAL SEMICONDUCTOR DEVICE USING THEM

PROBLEM TO BE SOLVED: To provide a curable silicone resin composition excellent in heat-resistant transparency and a cured product of the same, and an optical semiconductor device using them.SOLUTION: A curable silicone resin composition contains (A) component: a silicone resin that is represented by a specific formula and contains a hydrogen atom (SiH group) bonded to a silicon atom, (B) component: a silicone resin that is represented by a specific formula and contains a vinyl atom (Si-CH=CHgroup) bonded to the silicon atom, and (C) component: a platinum catalyst, where the total content of silanol groups (Si-OH groups) in the (A) component and the (B) component is 0.5-5.0 mmol/g, and the content of the platinum atoms in the (C) component is 0.003-3.0 ppm with respect to the total mass of the (A) component, the (B) component and the (C) component by a mass unit.SELECTED DRAWING: Figure 1 【課題】耐熱透明性に優れる硬化性シリコーン樹脂組成物およびその硬化物、並びにこれらを用いた光半導体装置を提供することを目的とする。【解決手段】（Ａ）成分： 特定の式で示され、ケイ素原子に結合する水素原子（ＳｉＨ基）を含有するシリコーン樹脂、（Ｂ）成分： 特定の式で示され、ケイ素原子に結合するビニル基（Ｓｉ−ＣＨ＝ＣＨ２基）を含有するシリコーン樹脂、および（Ｃ）成分： 白金触媒、を少なくとも含み、（Ａ）成分と（Ｂ）成分中のシラノール基（Ｓｉ−ＯＨ基）の総含有量が０．５〜５．０ｍｍｏｌ／ｇであり、（Ｃ）成分中の白金原子の含有量が、（Ａ）成分と（Ｂ）成分と（Ｃ）成分の合計質量に対して質量単位で０．００３〜３．０ｐｐｍである、硬化性シリコーン樹脂組成物。【選択図】図１