SUSPENSION SUBSTRATE WITH CIRCUIT

PROBLEM TO BE SOLVED: To provide a suspension substrate with a circuit capable of reinforcing each end portion of a plurality of terminal parts while improving connection reliability in each of the plurality of the terminal parts, and a manufacturing method of the suspension substrate with a circuit...

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Hauptverfasser: TERADA NAOHIRO, KANEZAKI SAORI, FUJIMURA HIROTO
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a suspension substrate with a circuit capable of reinforcing each end portion of a plurality of terminal parts while improving connection reliability in each of the plurality of the terminal parts, and a manufacturing method of the suspension substrate with a circuit.SOLUTION: A suspension substrate 1 with a circuit includes a base insulation layer 11 having a plurality of thick wall parts 22 and a plurality of thin wall parts 23. Each of the plurality of thick wall parts 22 is arranged so as to overlap each end portion of a plurality of external side terminals 32, in a crosswise direction, if projected in a depthwise direction. Each of the plurality of thin wall parts 23 is arranged between the plurality of external side terminals 32, in a longer direction, if projected in the depthwise direction.SELECTED DRAWING: Figure 4 【課題】複数の端子部のそれぞれの端部を補強できながら、複数の端子部のそれぞれにおける接続信頼性を向上できる回路付サスペンション基板、および、その製造方法を提供すること。【解決手段】回路付サスペンション基板1のベース絶縁層11は、複数の厚肉部22と、複数の薄肉部23とを備えている。複数の厚肉部22のそれぞれは、厚み方向に投影したときに、幅方向における複数の外部側端子32のそれぞれの端部と重なるように配置される。複数の薄肉部23のそれぞれは、厚み方向に投影したときに、長手方向において、複数の外部側端子32の間に配置される。【選択図】図4