DEPOSITION MASK DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC ELEMENT
PROBLEM TO BE SOLVED: To provide means that prevents a deposition material from adhering to each guide pin of a deposition mask device.SOLUTION: The deposition mask device 100 includes: first guide pins 11, 12 and second guide pins 13, 14 serving as multiple pins; a holding substrate 10 for holding...
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| creator | KARAKI TOSHIHIKO |
| description | PROBLEM TO BE SOLVED: To provide means that prevents a deposition material from adhering to each guide pin of a deposition mask device.SOLUTION: The deposition mask device 100 includes: first guide pins 11, 12 and second guide pins 13, 14 serving as multiple pins; a holding substrate 10 for holding a substrate to be deposited 30 using at least the first guide pins 11, 12 and the second guide pins 13, 14; a mask plate 20 provided with a first recess part 21, a second recess part 22, a third recess part 23 and a forth recess part 24 serving as recess parts for storing tips of the first guide pins 11, 12 and the second guide pins 13, 14 and a mask pattern 27.SELECTED DRAWING: Figure 1
【課題】成膜マスク装置の各ガイドピンに成膜材料が付着しないような手段を得る。【解決手段】成膜マスク装置１００は、複数のピンとしての第１のガイドピン１１，１２および第２のガイドピン１３，１４を備え、少なくとも第１のガイドピン１１，１２および第２のガイドピン１３，１４を用いて被成膜基板３０を保持する保持基板１０と、第１のガイドピン１１，１２および第２のガイドピン１３，１４の先端部を収容する凹み部としての第１の凹み部２１、第２の凹み部２２、第３の凹み部２３、および第４の凹み部２４、およびマスクパターン２７が設けられているマスク板２０とを備えている。【選択図】図１ |
| format | Patent |
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【課題】成膜マスク装置の各ガイドピンに成膜材料が付着しないような手段を得る。【解決手段】成膜マスク装置１００は、複数のピンとしての第１のガイドピン１１，１２および第２のガイドピン１３，１４を備え、少なくとも第１のガイドピン１１，１２および第２のガイドピン１３，１４を用いて被成膜基板３０を保持する保持基板１０と、第１のガイドピン１１，１２および第２のガイドピン１３，１４の先端部を収容する凹み部としての第１の凹み部２１、第２の凹み部２２、第３の凹み部２３、および第４の凹み部２４、およびマスクパターン２７が設けられているマスク板２０とを備えている。【選択図】図１</description><language>eng ; jpn</language><subject>CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160915&DB=EPODOC&CC=JP&NR=2016166380A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160915&DB=EPODOC&CC=JP&NR=2016166380A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KARAKI TOSHIHIKO</creatorcontrib><title>DEPOSITION MASK DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC ELEMENT</title><description>PROBLEM TO BE SOLVED: To provide means that prevents a deposition material from adhering to each guide pin of a deposition mask device.SOLUTION: The deposition mask device 100 includes: first guide pins 11, 12 and second guide pins 13, 14 serving as multiple pins; a holding substrate 10 for holding a substrate to be deposited 30 using at least the first guide pins 11, 12 and the second guide pins 13, 14; a mask plate 20 provided with a first recess part 21, a second recess part 22, a third recess part 23 and a forth recess part 24 serving as recess parts for storing tips of the first guide pins 11, 12 and the second guide pins 13, 14 and a mask pattern 27.SELECTED DRAWING: Figure 1
【課題】成膜マスク装置の各ガイドピンに成膜材料が付着しないような手段を得る。【解決手段】成膜マスク装置１００は、複数のピンとしての第１のガイドピン１１，１２および第２のガイドピン１３，１４を備え、少なくとも第１のガイドピン１１，１２および第２のガイドピン１３，１４を用いて被成膜基板３０を保持する保持基板１０と、第１のガイドピン１１，１２および第２のガイドピン１３，１４の先端部を収容する凹み部としての第１の凹み部２１、第２の凹み部２２、第３の凹み部２３、および第４の凹み部２４、およびマスクパターン２７が設けられているマスク板２０とを備えている。【選択図】図１</description><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHBzcQ3wD_YM8fT3U_B1DPZWcHEN83R2VXD0c1HwdQ3x8HdRcPMPAkr5hbo5OoeEBnn6uSu4-rg6hwT5-3k6g5i-rn4hPAysaYk5xam8UJqbQcnNNcTZQze1ID8-tbggMTk1L7Uk3ivAyMDQzNDMzNjCwNGYKEUAAcwsvg</recordid><startdate>20160915</startdate><enddate>20160915</enddate><creator>KARAKI TOSHIHIKO</creator><scope>EVB</scope></search><sort><creationdate>20160915</creationdate><title>DEPOSITION MASK DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC ELEMENT</title><author>KARAKI TOSHIHIKO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2016166380A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2016</creationdate><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>KARAKI TOSHIHIKO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KARAKI TOSHIHIKO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>DEPOSITION MASK DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC ELEMENT</title><date>2016-09-15</date><risdate>2016</risdate><abstract>PROBLEM TO BE SOLVED: To provide means that prevents a deposition material from adhering to each guide pin of a deposition mask device.SOLUTION: The deposition mask device 100 includes: first guide pins 11, 12 and second guide pins 13, 14 serving as multiple pins; a holding substrate 10 for holding a substrate to be deposited 30 using at least the first guide pins 11, 12 and the second guide pins 13, 14; a mask plate 20 provided with a first recess part 21, a second recess part 22, a third recess part 23 and a forth recess part 24 serving as recess parts for storing tips of the first guide pins 11, 12 and the second guide pins 13, 14 and a mask pattern 27.SELECTED DRAWING: Figure 1
【課題】成膜マスク装置の各ガイドピンに成膜材料が付着しないような手段を得る。【解決手段】成膜マスク装置１００は、複数のピンとしての第１のガイドピン１１，１２および第２のガイドピン１３，１４を備え、少なくとも第１のガイドピン１１，１２および第２のガイドピン１３，１４を用いて被成膜基板３０を保持する保持基板１０と、第１のガイドピン１１，１２および第２のガイドピン１３，１４の先端部を収容する凹み部としての第１の凹み部２１、第２の凹み部２２、第３の凹み部２３、および第４の凹み部２４、およびマスクパターン２７が設けられているマスク板２０とを備えている。【選択図】図１</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | DEPOSITION MASK DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC ELEMENT |
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