LEAD MOLDING EQUIPMENT AND LEAD MOLDING METHOD

PROBLEM TO BE SOLVED: To provide lead molding equipment which can easily bend leads in two directions in a simple structure without using a complex configuration such as a slide mechanism.SOLUTION: Lead molding equipment 10 comprises bending dies 13a, 13b that receives leads 53, 54 of an electronic...

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1. Verfasser: KARAKI TOSHIHIKO
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide lead molding equipment which can easily bend leads in two directions in a simple structure without using a complex configuration such as a slide mechanism.SOLUTION: Lead molding equipment 10 comprises bending dies 13a, 13b that receives leads 53, 54 of an electronic component 50, bending punches 20a, 20b that have flexibility and bend the leads 53, 54 by pressing while moving in a first direction (+Z axis direction) toward the bending dies 13a, 13b, and guides 14a, 14b that have inclined planes 24a, 24b inclined so that the depth side in the first direction may come closer to a virtual perpendicular line passing through the center of the electronic component 50 in a plan view than to the near side in the first direction to make the bending punches 20a, 20b moved in the first direction come in contact.SELECTED DRAWING: Figure 2 【課題】スライド機構などの複雑な構成を用いることなく、簡便な構成で容易に二つの方向にリードを曲げることが可能なリード成形装置を提供する。【解決手段】リード成形装置10は、電子部品50のリード53,54を受ける曲げダイ13a,13bと、可撓性を有し、曲げダイ13a,13bに向かう第1方向(+Z軸方向)に移動しながらリード53,54を押し曲げる曲げパンチ20a,20bと、第1方向の奥側が、第1方向の手前側よりも電子部品50の平面視中心を通る仮想垂線に近づくように傾斜し、第1方向に移動した曲げパンチ20a,20bが当接する傾斜面24a,24bを有しているガイド部14a,14bと、を備えている。【選択図】図2