MULTILAYER WIRING BOARD

PROBLEM TO BE SOLVED: To make it possible to guarantee a separation distance stipulated by essentially safe explosion-proof while using a multilayer wiring board of a standard specification.SOLUTION: When forming a wiring pattern to a printed wiring surface of surface layers L1, L4 and inner layers...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	MAMADA KOICHI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!