MULTILAYER WIRING BOARD

PROBLEM TO BE SOLVED: To make it possible to guarantee a separation distance stipulated by essentially safe explosion-proof while using a multilayer wiring board of a standard specification.SOLUTION: When forming a wiring pattern to a printed wiring surface of surface layers L1, L4 and inner layers...

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Bibliographische Detailangaben
1. Verfasser:	MAMADA KOICHI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To make it possible to guarantee a separation distance stipulated by essentially safe explosion-proof while using a multilayer wiring board of a standard specification.SOLUTION: When forming a wiring pattern to a printed wiring surface of surface layers L1, L4 and inner layers L2, L3 of a multilayer wiring board (four layered wiring board of a standard specification) 101, a wiring pattern is to be formed at a position avoiding being within a separation distance d speculated by essentially safe explosion-proof from a wiring pattern formed on a printed wiring surface of a neighboring layer (not to form a wiring pattern within a separation distance d).SELECTED DRAWING: Figure 1 【課題】標準仕様の多層配線基板を用いたまま、本質安全防爆で規定されている離隔距離を保証できるようにする。【解決手段】多層配線基板（標準仕様の４層の配線基板）１０１の表面層Ｌ１，Ｌ４および内層Ｌ２，Ｌ３のプリント配線面への配線パターンの形成に際し、隣接する層のプリント配線面上に形成されている配線パターンから本質安全防爆で規定されている離隔距離ｄ内を避けた位置に、配線パターンを形成するようにする（離隔距離ｄ内には配線パターンを形成しないようにする）。【選択図】図１