PHOTOCURABLE THERMOSETTING RESIN COMPOSITION, CURED PRODUCT OF THE SAME, AND PRINTED WIRING BOARD

PROBLEM TO BE SOLVED: To provide a photocurable thermosetting resin composition excellent in both sensitivity and heat resistance, a cured product of the composition, and a printed wiring board.SOLUTION: The photocurable thermosetting resin composition of the present invention comprises: a carboxyl group-containing photosensitive organic-inorganic hybrid resin varnish (A) described below; a photopolymerization initiator (B); and an organic nitrogen compound (C). The component (A) is obtained by allowing a compound (A-2) obtained by a hydrolysis condensation reaction of a silane compound containing at least one silane compound having a (meth)acryloyl group to partially react with a hydroxyl group of a photosensitive resin (A-1) containing a carboxyl group, which is obtained by allowing an unsaturated monocarboxylic acid (a2) to react with an epoxy group of a polyfunctional epoxy resin (a1) and further allowing the obtained reaction product to react with a polybasic acid anhydride (a3) so as to leave a part of hydroxyl groups.SELECTED DRAWING: None 【課題】感度とはんだ耐熱性との双方に優れる光硬化性熱硬化性樹脂組成物、その硬化物、およびプリント配線板を提供する。【解決手段】本発明の光硬化性熱硬化性樹脂組成物は、多官能エポキシ樹脂（ａ１）のエポキシ基に対し、不飽和モノカルボン酸（ａ２）を反応させ、その反応生成物に対し、水酸基の一部が残存するように多塩基酸無水物（ａ３）を反応させて得られるカルボキシル基を含有する感光性樹脂（Ａ−１）の水酸基に対し、（メタ）アクリロイル基を有するシラン化合物を少なくとも１種含むシラン化合物を加水分解縮合反応させて得られる化合物（Ａ−２）を部分的に反応させて得られるカルボキシル基含有感光性有機無機ハイブリッド樹脂ワニス（Ａ）と、光重合開始剤（Ｂ）と、有機窒素化合物（Ｃ）と、を含むことを特徴とする。【選択図】なし