HEAT RADIATION STRUCTURE
PROBLEM TO BE SOLVED: To provide a heat radiation structure which effectively radiates heat generated by an electronic component and is easily manufactured.SOLUTION: A heat radiation structure includes at least one heating element 1 to 4; at least one base body 10 having a first major surface 10A an...
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Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a heat radiation structure which effectively radiates heat generated by an electronic component and is easily manufactured.SOLUTION: A heat radiation structure includes at least one heating element 1 to 4; at least one base body 10 having a first major surface 10A and a second major surface 10B positioned at the opposite side of the first major surface 10A and in which the heating element is mounted on the first major surface 10A; and at least one first fin 20 connected to the second major surface 10B. A material forming the base body 10 contains a metal. A material mainly forming the first fin 20 is a resin. The second major surface 10B of the base body 10 includes a first irregularity part 30 in which irregularities are formed. An area of the second major surface 10B, which is connected to the first fin 20, includes the first irregularity part 30.SELECTED DRAWING: Figure 2
【課題】電子部品に生じた熱を効果的に放熱することができ、かつ、容易に製造可能な放熱構造体を提供する。【解決手段】少なくとも1つの発熱体1〜4と、第1主面10Aと第1主面10Aの反対側に位置する第2主面10Bとを有し、第1主面10A上に発熱体を搭載している少なくとも1つのベース体10と、第2主面10Bに接続されている少なくとも1つの第1フィン20とを備える。ベース体10を構成する材料は金属を含み、第1フィン20を主に構成する材料は樹脂である。ベース体10の第2主面10Bは、凹凸が形成された第1凹凸部30を含む。第2主面10Bにおいて第1フィン20と接続されている領域は第1凹凸部30を含んでいる。【選択図】図2 |
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