THERMAL INSULATION MATERIAL

PROBLEM TO BE SOLVED: To provide a thermal insulation material which can fully secure thermal insulation properties even if quasicrystalline alloy is incorporated.SOLUTION: The thermal insulation material is provided in which 17 mass% or more of hollow nano silica is mixed in AlCuFe-based quasicryst...

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Bibliographische Detailangaben
Hauptverfasser: MAEKAWA RYOSUKE, YOSHINAGA YASUZO
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a thermal insulation material which can fully secure thermal insulation properties even if quasicrystalline alloy is incorporated.SOLUTION: The thermal insulation material is provided in which 17 mass% or more of hollow nano silica is mixed in AlCuFe-based quasicrystalline alloy and which therefore has a further improved thermal insulation properties since a thermal conductivity of AlCuFe-based quasicrystalline alloy containing a specified quantity or more of hollow nano silica can obtain a thermal conductivity lower than a thermal conductivity predicted according to a compounding ratio between the AlCuFe-based quasicrystalline alloy and the hollow nano silica.SELECTED DRAWING: Figure 1 【課題】準結晶合金を含有させた場合であっても、断熱性を充分確保できる断熱材料を提供することを目的とする。【解決手段】AlCuFe系準結晶合金に、所定量以上の中空ナノシリカを含有させると、AlCuFe系準結晶合金と中空ナノシリカの配合比から予測され得る熱伝導率よりも低い熱伝導率を得られることに着目し、AlCuFe系準結晶合金に、中空ナノシリカが17質量%以上混合された断熱材料として、断熱性を一層向上させる。【選択図】図1