PHOTOCURABLE THERMOSETTING RESIN COMPOSITION, CURED PRODUCT OF THE SAME AND PRINTED WIRING BOARD

PROBLEM TO BE SOLVED: To provide a photocurable thermosetting resin composition that is more excellent in developability, surface curability, resolution and solder heat resistance than the conventional ones and is capable of being developed with an alkali by a solventless and non-contact exposure sy...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	INAGAKI SHOJI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a photocurable thermosetting resin composition that is more excellent in developability, surface curability, resolution and solder heat resistance than the conventional ones and is capable of being developed with an alkali by a solventless and non-contact exposure system, to provide a cured product of the resin composition and to provide a printed wiring board.SOLUTION: The photocurable thermosetting resin composition capable of being developed with an alkali by a solventless and non-contact exposure system comprises (A) an active energy ray-curable resin wax produced by reacting a reaction product of (a) a novolac type epoxy compound and (b) an unsaturated monocarboxylic acid with (c) a saturated or unsaturated polybasic acid anhydride and reacting the saturated or unsaturated polybasic acid anhydride (c) which is unreacted and (d) a hydroxyl group-containing monomer to eliminate the saturated or unsaturated polybasic acid anhydride (c) which is unreacted, (B) a photopolymerization initiator or a mixture of a photopolymerization initiator and a sensitizer and (C) a thermosetting component.SELECTED DRAWING: None 【課題】これまで以上に現像性、表面硬化性、解像性およびはんだ耐熱性に優れた、無溶剤非接触露光方式でアルカリ現像可能な光硬化性熱硬化性樹脂組成物、その硬化物およびプリント配線板を提供する。【解決手段】本発明の無溶剤非接触露光方式でアルカリ現像可能な光硬化性熱硬化性樹脂組成物は、（Ａ）（ａ）ノボラック型エポキシ化合物と（ｂ）不飽和モノカルボン酸との反応物と、（ｃ）飽和または不飽和多塩基酸無水物とを反応させ、未反応の（ｃ）飽和または不飽和多塩基酸無水物と、（ｄ）水酸基含有モノマーとを反応させることによって前記未反応の（ｃ）飽和または不飽和多塩基酸無水物を消失させてなる活性エネルギー線硬化性樹脂ワニス、（Ｂ）光重合開始剤、または光重合開始剤と増感剤との混合物、および（Ｃ）熱硬化性成分を含んでなる。【選択図】なし