ELECTRONIC COMPONENT AND MANUFACTURING METHOD OF THE SAME
PROBLEM TO BE SOLVED: To provide an electronic component which secures airtightness and enables improvement of heat radiation performance.SOLUTION: An electronic component 1 includes: a package 10 having a cavity C housing an element 30 and a through hole 16 allowing an interior part and an exterior...
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| Format: | Patent |
| Sprache: | eng ; jpn |
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| Zusammenfassung: | PROBLEM TO BE SOLVED: To provide an electronic component which secures airtightness and enables improvement of heat radiation performance.SOLUTION: An electronic component 1 includes: a package 10 having a cavity C housing an element 30 and a through hole 16 allowing an interior part and an exterior part of the cavity C to communicate with each other; and a filler 40 filling a space between the element 30 and a lid substrate 12 of the package 10 and closing the through hole 16. The element 30 has a mounting surface 31 and the filler 40 contacts with a portion of the element 30 which excludes the mounting surface 31.SELECTED DRAWING: Figure 2
【課題】気密性が確保されるとともに放熱性が向上する電子部品を提供する。【解決手段】電子部品１は、素子３０を収容するキャビティＣと、キャビティＣの内外を連通する貫通孔１６と、を有するパッケージ１０と、素子３０とパッケージ１０のリッド基板１２との間に充填されるとともに貫通孔１６を閉塞する充填剤４０と、を備える。素子３０は、実装面３１を有し、充填剤４０は、素子３０における実装面３１以外の部分に接している。【選択図】図２ |
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