ELECTROSPRAY DEVICE
PROBLEM TO BE SOLVED: To provide an electrospray device capable of restraining the occurrence of a variation in the thickness of a formed thin film, while restraining a mask from being polluted.SOLUTION: This electrospray device 100 is constituted so as to form a thin film 201 by spraying a solution...
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| Format: | Patent |
| Sprache: | eng ; jpn |
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| Zusammenfassung: | PROBLEM TO BE SOLVED: To provide an electrospray device capable of restraining the occurrence of a variation in the thickness of a formed thin film, while restraining a mask from being polluted.SOLUTION: This electrospray device 100 is constituted so as to form a thin film 201 by spraying a solution material while making a nozzle 1 move in a corresponding coating area 200a in a state of setting a first distance L1 along the vertical direction to a substrate 200 between the nozzle 1 and the substrate 200 in the vicinity of an end part 2b of an opening part 2a, to be smaller than a second distance L2 along the vertical direction to the substrate 200 between the nozzle 1 and the substrate 200 except for the vicinity of the end part 2b of the opening part 2a.SELECTED DRAWING: Figure 1
【課題】マスクが汚染されることを抑制しながら、形成される薄膜の厚みにばらつきが生じることを抑制することが可能なエレクトロスプレー装置を提供する。【解決手段】このエレクトロスプレー装置１００は、開口部２ａの端部２ｂ近傍におけるノズル１と基板２００との間の基板２００に垂直な方向に沿った第１距離Ｌ１を、開口部２ａの端部２ｂ近傍以外におけるノズル１と基板２００との間の基板２００に垂直な方向に沿った第２距離Ｌ２よりも小さく設定した状態で、ノズル１が対応する塗布領域２００ａ内で移動しながら溶液材料を噴霧することにより、薄膜２０１を形成するように構成されている。【選択図】図１ |
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