ELECTRONIC APPARATUS

PROBLEM TO BE SOLVED: To provide an electronic apparatus capable of suppressing both short-circuit between electrodes and deteriorated heat dissipation.SOLUTION: An electronic apparatus 100 includes a circuit board 10, a semiconductor device 20, a first bonding member 31 and a clip 50. The clip 50 i...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KAMIMURA RIKIYA, YAMASHITA YUKINORI, NAKAMA KEITARO
Format: Patent
Sprache:eng ; jpn
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide an electronic apparatus capable of suppressing both short-circuit between electrodes and deteriorated heat dissipation.SOLUTION: An electronic apparatus 100 includes a circuit board 10, a semiconductor device 20, a first bonding member 31 and a clip 50. The clip 50 includes: a first opposite part 51 which includes a connection 55 which faces a drain electrode and to which a first bonding member 31 is connected; a second opposite part 52 which faces the circuit board 10 and is connected to the circuit board 10; and a connection 53 which connects the first opposite part 51 to the second opposite part 52. A metal ball 40 is disposed in the first bonding member 31 so as to prescribe a gap in all opposite regions between the drain electrode and the connection 55. On the first opposite part 51, a suction part 54 is formed in the periphery of the connection 55 so as to suck the first bonding member 31 existent out of the opposite region.SELECTED DRAWING: Figure 1 【課題】電極間のショートを抑制できると共に、放熱性の低下を抑制できる電子装置を提供すること。【解決手段】電子装置100は、回路基板10と、半導体素子20と、第1接合部材31と、クリップ50とを備えて構成されている。クリップ50は、ドレイン電極に対向して第1接合部材31が接続された接続部55を含む第1対向部51と、回路基板10に対向しており回路基板10と接続された第2対向部52と、第1対向部51と第2対向部52とを連結している連結部53とを有している。第1接合部材31内には、ドレイン電極と接続部55との対向領域全域の間隔を規定するための金属ボール40が配置されている。第1対向部51は、接続部55の周辺に、対向領域外の第1接合部材31を吸い取る吸い取り部54が形成されている。【選択図】図1