SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To enable a heat sink arranged between a semiconductor chip and a substrate to solve such a problem that an adhesive portion between the heat sink and the substrate is peeled by a stress caused by thermal expansion or thermal contraction.SOLUTION: A semiconductor device has: a substrate of which a surface is an insulating material; a semiconductor chip flip-chip-connected onto the substrate; and a heat sink which is bonded to the semiconductor chip through a thermal interface material and is fixed to the substrate in the outside of the semiconductor chip. The heat sink has a projection which is bonded to the substrate by a conductive resin projecting to the substrate between a portion bonded to the semiconductor chip and a portion fixed to the substrate. The heat sink has a thin wall portion.SELECTED DRAWING: Figure 2 【課題】本発明は、半導体チップ及び基板に配置された放熱板が、熱膨張又は熱収縮に伴う応力により、放熱板と基板との接着部が剥がれる問題を解決することを、目的の一つとする。【解決手段】表面が絶縁材料の基板と、前記基板上にフリップチップ接続された半導体チップと、熱界面材料を介して前記半導体チップに接着され、前記基板に前記半導体チップの外側で固定された放熱板とを有し、前記放熱板は、前記半導体チップと接着した部分と前記基板と固定した部分との間に、前記基板に向かって突出し導電性樹脂により前記基板に接着される突起部を有し、前記放熱板は、薄肉部を有することを特徴とする半導体装置を提供する。【選択図】図２