POLISHING COMPOSITION
PROBLEM TO BE SOLVED: To provide a polishing composition which can polish a sapphire wafer at an excellent polishing rate.SOLUTION: A polishing composition comprises a silica particle, a glycol ether compound, and water. A content of the glycol ether compound in the polishing composition is 0.1 mass...
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| creator | OTO TAKESHI CHINEN MIKA MORIYAMA KAZUKI EZAWA SHUNJI |
| description | PROBLEM TO BE SOLVED: To provide a polishing composition which can polish a sapphire wafer at an excellent polishing rate.SOLUTION: A polishing composition comprises a silica particle, a glycol ether compound, and water. A content of the glycol ether compound in the polishing composition is 0.1 mass% or more and 10 mass% or less.SELECTED DRAWING: None
【課題】優れた研磨速度でサファイアウェーハを研磨することができる研磨用組成物を提供する。【解決手段】研磨用組成物は、シリカ粒子と、グリコールエーテル化合物と、水と、を含む。研磨用組成物に含まれるグリコールエーテル化合物の含有量は、０．１質量％以上且つ１０質量％以下である。【選択図】なし |
| format | Patent |
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【課題】優れた研磨速度でサファイアウェーハを研磨することができる研磨用組成物を提供する。【解決手段】研磨用組成物は、シリカ粒子と、グリコールエーテル化合物と、水と、を含む。研磨用組成物に含まれるグリコールエーテル化合物の含有量は、０．１質量％以上且つ１０質量％以下である。【選択図】なし</description><language>eng ; jpn</language><subject>ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; DYES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; PAINTS ; PERFORMING OPERATIONS ; POLISHES ; POLISHING ; POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH ; SEMICONDUCTOR DEVICES ; SKI WAXES ; TRANSPORTING</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160808&DB=EPODOC&CC=JP&NR=2016141765A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25553,76306</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160808&DB=EPODOC&CC=JP&NR=2016141765A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>OTO TAKESHI</creatorcontrib><creatorcontrib>CHINEN MIKA</creatorcontrib><creatorcontrib>MORIYAMA KAZUKI</creatorcontrib><creatorcontrib>EZAWA SHUNJI</creatorcontrib><title>POLISHING COMPOSITION</title><description>PROBLEM TO BE SOLVED: To provide a polishing composition which can polish a sapphire wafer at an excellent polishing rate.SOLUTION: A polishing composition comprises a silica particle, a glycol ether compound, and water. A content of the glycol ether compound in the polishing composition is 0.1 mass% or more and 10 mass% or less.SELECTED DRAWING: None
【課題】優れた研磨速度でサファイアウェーハを研磨することができる研磨用組成物を提供する。【解決手段】研磨用組成物は、シリカ粒子と、グリコールエーテル化合物と、水と、を含む。研磨用組成物に含まれるグリコールエーテル化合物の含有量は、０．１質量％以上且つ１０質量％以下である。【選択図】なし</description><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>DYES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>PAINTS</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHES</subject><subject>POLISHING</subject><subject>POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SKI WAXES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBAN8PfxDPbw9HNXcPb3DfAP9gzx9PfjYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBoZmhiaG5mamjsZEKQIA7IEfkw</recordid><startdate>20160808</startdate><enddate>20160808</enddate><creator>OTO TAKESHI</creator><creator>CHINEN MIKA</creator><creator>MORIYAMA KAZUKI</creator><creator>EZAWA SHUNJI</creator><scope>EVB</scope></search><sort><creationdate>20160808</creationdate><title>POLISHING COMPOSITION</title><author>OTO TAKESHI ; CHINEN MIKA ; MORIYAMA KAZUKI ; EZAWA SHUNJI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2016141765A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2016</creationdate><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>DYES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>PAINTS</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHES</topic><topic>POLISHING</topic><topic>POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SKI WAXES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>OTO TAKESHI</creatorcontrib><creatorcontrib>CHINEN MIKA</creatorcontrib><creatorcontrib>MORIYAMA KAZUKI</creatorcontrib><creatorcontrib>EZAWA SHUNJI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>OTO TAKESHI</au><au>CHINEN MIKA</au><au>MORIYAMA KAZUKI</au><au>EZAWA SHUNJI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>POLISHING COMPOSITION</title><date>2016-08-08</date><risdate>2016</risdate><abstract>PROBLEM TO BE SOLVED: To provide a polishing composition which can polish a sapphire wafer at an excellent polishing rate.SOLUTION: A polishing composition comprises a silica particle, a glycol ether compound, and water. A content of the glycol ether compound in the polishing composition is 0.1 mass% or more and 10 mass% or less.SELECTED DRAWING: None
【課題】優れた研磨速度でサファイアウェーハを研磨することができる研磨用組成物を提供する。【解決手段】研磨用組成物は、シリカ粒子と、グリコールエーテル化合物と、水と、を含む。研磨用組成物に含まれるグリコールエーテル化合物の含有量は、０．１質量％以上且つ１０質量％以下である。【選択図】なし</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DRESSING OR CONDITIONING OF ABRADING SURFACES DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PERFORMING OPERATIONS POLISHES POLISHING POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH SEMICONDUCTOR DEVICES SKI WAXES TRANSPORTING |
| title | POLISHING COMPOSITION |
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