MOUNTING DEVICE OF SEMICONDUCTOR OR ELECTRONIC COMPONENT, AND MOUNTING METHOD OF SEMICONDUCTOR OR ELECTRONIC COMPONENT

MOUNTING DEVICE OF SEMICONDUCTOR OR ELECTRONIC COMPONENT, AND MOUNTING METHOD OF SEMICONDUCTOR OR ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To solve a problem of wasteful bonding caused by an inappropriate position or an inappropriate shape of bonded die in subsequent lamination bonding.SOLUTION: A die bonder includes a bonding head for bonding a die on a substrate based on measured information relevant to a portio...

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Bibliographische Detailangaben
1. Verfasser: ODAKAMINE YUUJI
Format: Patent
Sprache:eng ; jpn
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Zusammenfassung:PROBLEM TO BE SOLVED: To solve a problem of wasteful bonding caused by an inappropriate position or an inappropriate shape of bonded die in subsequent lamination bonding.SOLUTION: A die bonder includes a bonding head for bonding a die on a substrate based on measured information relevant to a portion of the bonded die on the substrate where the die is bonded.SELECTED DRAWING: Figure 1 【課題】本発明の課題は、ボンディングされたダイの位置若しくは形状がその後の積層ボンディングにおいて不適切であることから生じる無駄なボンディングを解決することにある。【解決手段】ダイがボンディングされた基板における前記ボンディングされたダイの部分に関して測定された情報に基づき、前記基板にダイをボンディングするボンディングヘッドを備えたダイボンダ。【選択図】図１