METHOD AND DEVICE FOR PROCESSING MULTILAYER SUBSTRATE WITH LASER BEAM

PROBLEM TO BE SOLVED: To enable processing of a multilayer substrate by a simple configuration without increasing a device cost.SOLUTION: This processing method for processing the multilayer substrate by radiating a laser beam includes a preparing step and a processing step. In the preparing step, t...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	NAKATANI FUMIYOSHI, ARAKAWA MIKI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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