METHOD AND DEVICE FOR PROCESSING MULTILAYER SUBSTRATE WITH LASER BEAM

PROBLEM TO BE SOLVED: To enable processing of a multilayer substrate by a simple configuration without increasing a device cost.SOLUTION: This processing method for processing the multilayer substrate by radiating a laser beam includes a preparing step and a processing step. In the preparing step, t...

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Bibliographische Detailangaben
Hauptverfasser:	NAKATANI FUMIYOSHI, ARAKAWA MIKI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To enable processing of a multilayer substrate by a simple configuration without increasing a device cost.SOLUTION: This processing method for processing the multilayer substrate by radiating a laser beam includes a preparing step and a processing step. In the preparing step, the multilayer substrate in which at least a first layer and a second layer are layered is prepared. In the processing step, the laser beam having a predetermined absorption rate capable of processing and permeating the first layer and a wavelength capable of processing the second layer is radiated from a side of the first layer to process the first layer and the second layer concurrently.SELECTED DRAWING: Figure 2 【課題】簡単な構成で、装置のコストを高価にすることなく、多層基板を加工できるようにする。【解決手段】この加工方法は、多層基板にレーザ光を照射して加工する方法であって、準備工程と、加工工程と、を含む。準備工程では、積層された少なくとも第１層及び第２層からなる多層基板を準備する。加工工程では、第１層に対して加工可能でかつ透過可能な所定の吸収率を有するとともに第２層を加工可能な波長のレーザ光を、第１層側から照射して第１層及び第２層を同時に加工する。【選択図】図２