MANUFACTURING METHOD OF LAMINATED PLATE AND MULTILAYER CIRCUIT BOARD

PROBLEM TO BE SOLVED: To provide a laminated plate using an insulating film composed of a II type liquid crystal polymer, and suppress the occurrence of conduction failure between layers when a multilayer circuit board is formed.SOLUTION: There is provided a manufacturing method of a laminated plate...

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Bibliographische Detailangaben
Hauptverfasser:	TOTANI MAKOTO, MIYAGAWA EIJIRO, SUZUKI TARO, KONDO KOJI, TACHIBANA EISUKE
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a laminated plate using an insulating film composed of a II type liquid crystal polymer, and suppress the occurrence of conduction failure between layers when a multilayer circuit board is formed.SOLUTION: There is provided a manufacturing method of a laminated plate obtained by laminating an insulating film composed of a II type liquid crystal polymer and a metal foil and used for manufacturing a multilayer circuit board, the method including: a drying step of heating the insulating film at temperatures of 120 to 250°C for 20 seconds or more before drying the insulating film; and a thermal compression bonding step of applying pressure to the dried insulating film and the metal foil at a pressure of 0.5 to 10 MPa for 10 to 600 seconds while heating at temperatures of 250 to 330°C to thermally bond the insulating film and the metal foil to form a laminated plate.SELECTED DRAWING: None 【課題】ＩＩ型液晶ポリマーからなる絶縁フィルムを用いた積層板に関して、多層回路基板を形成した際における層間の導通不良の発生を抑制する。【解決手段】ＩＩ型液晶ポリマーからなる絶縁フィルムと金属箔とを積層してなり、多層回路基板の製造に用いられる積層板の製造方法は、絶縁フィルムを１２０〜２５０℃の温度で２０秒以上加熱して乾燥させる乾燥工程と、乾燥された絶縁フィルムと金属箔とを２５０〜３３０℃の温度で加熱しながら、０．５〜１０ＭＰａの圧力にて１０〜６００秒間、加圧することにより熱圧着させて積層板を形成する熱圧着工程とを有する。【選択図】なし