IMAGING APPARATUS
PROBLEM TO BE SOLVED: To provide an imaging apparatus capable of providing a thick conversion layer on a target substrate.SOLUTION: The imaging apparatus includes: a radiation receiving substrate part 4 having a radiation conversion layer 23; and an electron emission substrate part 2, facing the rad...
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| Format: | Patent |
| Sprache: | eng ; jpn |
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| Zusammenfassung: | PROBLEM TO BE SOLVED: To provide an imaging apparatus capable of providing a thick conversion layer on a target substrate.SOLUTION: The imaging apparatus includes: a radiation receiving substrate part 4 having a radiation conversion layer 23; and an electron emission substrate part 2, facing the radiation receiving substrate part 4 with a vacuum space 3, for emitting electrons toward the radiation conversion layer 23. The radiation receiving substrate part 4 includes: a support substrate 21; and the radiation conversion layer 23, pasted on the support substrate 21, made of a compound semiconductor crystal.SELECTED DRAWING: Figure 1
【課題】 本発明は、ターゲット基板に、厚い変換層を設けることが可能な撮像装置を提供することを課題としている。【解決手段】 放射線変換層２３を有する受線基板部４と、真空空間３を存して受線基板部４に対面し、放射線変換層２３に向かって電子を放出する電子放出基板部２と、を備え、受線基板部４は、支持基板２１と、支持基板２１上に貼り付けられた、化合物半導体結晶から成る上記放射線変換層２３と、を有している。【選択図】 図１ |
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