MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE AND MANAGEMENT METHOD OF MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a management method of a manufacturing apparatus of a semiconductor device capable of properly determining the amount of contamination.SOLUTION: The management method of the manufacturing apparatus includes: a step S13 to measure the weight of a substrate before expo...

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1. Verfasser: SHIOBARA HIDESHI
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a management method of a manufacturing apparatus of a semiconductor device capable of properly determining the amount of contamination.SOLUTION: The management method of the manufacturing apparatus includes: a step S13 to measure the weight of a substrate before exposure, which includes a semiconductor substrate and a resist film which is formed over the semiconductor substrate; a step S14 to perform an exposure processing on the resist film; a step S15 to measure the weight of the substrate after exposure, which includes the semiconductor substrate and resist film after the exposure processing; and a step S17 to calculate a weight difference between the weight of the substrate before exposure and the weight of the substrate after exposure.SELECTED DRAWING: Figure 2 【課題】コンタミネーションの量を的確に判断することが可能な半導体装置の製造装置の管理方法を提供する。【解決手段】半導体基板及び半導体基板上に設けられたレジスト膜を含む露光前基板の重量を測定する工程S13と、レジスト膜に対して露光処理を行う工程S14と、半導体基板及び露光処理が行われたレジスト膜を含む露光後基板の重量を測定する工程S15と、露光前基板の重量と露光後基板の重量との重量差を求める工程S17と、を備える。【選択図】図2