SUBSTRATE FOR PRINT CIRCUIT BOARD, PRINT CIRCUIT BOARD, AND MANUFACTURING METHOD OF SUBSTRATE FOR PRINT CIRCUIT BOARD

PROBLEM TO BE SOLVED: To provide a substrate for a print circuit board which comprises a metal layer having a large peel intensity and is inexpensive.SOLUTION: A substrate for a print circuit board according to an embodiment of the present invention, is the substrate for a print circuit board comprising: a base film having an insulation quality; and a metal layer laminated at least one surface side of the base film, and includes a distribution part in which palladium is distributed and existed in the base film. It is preferable that palladium exists so as to have a content percentage of 1 mass% or more in the distribution part by quantitative determination with an EDX. It is preferable that the distribution part includes a region of an average of 500 nm or more from an interface with the metal layer. It is preferable that the content percentage of palladium of an A layer of 1 μm or less in a thickness direction from the interface with the metal layer in the base film is larger than that of a B layer of 500 nm or less in the thickness direction from the interface with the metal layer in the base film.SELECTED DRAWING: Figure 1 【課題】本発明は、剥離強度の大きい金属層を備える安価なプリント配線板用基板を提供することを課題とする。【解決手段】本発明の一実施形態に係るプリント配線板用基板は、絶縁性を有するベースフィルムと、このベースフィルムの少なくとも一方の面側に積層される金属層とを備えるプリント配線板用基板であって、上記ベースフィルム中にパラジウムが分散して存在する分散部分を有する。上記分散部分で、ＥＤＸによる定量で含有率が１質量％以上となるようパラジウムが存在するとよい。上記分散部分が、金属層との界面から平均５００ｎｍ以上の領域を含むとよい。上記ベースフィルムにおける金属層との界面から厚さ方向に１μｍ以下のＡ層のパラジウム含有率が、上記金属層におけるベースフィルムとの界面から厚さ方向に５００ｎｍ以下のＢ層のパラジウム含有率より大きいとよい。【選択図】図１