ADHESIVE TAPE, METHOD FOR PRODUCING THE SAME, ARTICLE AND PORTABLE ELECTRONIC TERMINAL

PROBLEM TO BE SOLVED: To provide an adhesive tape having excellent impact resistance without causing peeling or the like due to shocks such as falling even when it is thinner than conventional one.SOLUTION: There is provided an adhesive tape which has a structure in which an adhesive layer (B) is la...

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Bibliographische Detailangaben
Hauptverfasser:	KANEKAWA YOSHINORI, KITADE YUYA, TAKEI HIDEAKI, FUJIWARA TOYOKUNI, NAKAJIMA HIROYUKI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES TRANSPORTING USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an adhesive tape having excellent impact resistance without causing peeling or the like due to shocks such as falling even when it is thinner than conventional one.SOLUTION: There is provided an adhesive tape which has a structure in which an adhesive layer (B) is laminated directly or via other layer on at least one surface of a substrate layer (A) having a storage elastic modulus (E') measured at a temperature of -10°C and a frequency of 1.0 Hz of 1×10Pa or less and can be suitably used in producing an electronic device, for example a portable electronic terminal.SELECTED DRAWING: Figure 1 【課題】本発明が解決しようとする課題は、従来より薄型であっても、落下等の衝撃による剥がれ等を引き起こすことがない優れた耐衝撃性を備えた粘着テープを提供することである。【解決手段】本発明は、温度−１０℃及び周波数１．０Ｈｚで測定された貯蔵弾性率（Ｅ'−１０）が１×１０８Ｐａ以下である基材層（Ａ）の少なくとも片面に、直接または他の層を介して、粘着剤層（Ｂ）が積層された構成を有することを特徴とする粘着テープに関するものであって、例えば携帯電子端末等の電子機器の製造場面で好適に使用できるものである。【選択図】図１