COMPOSITE COPPER POWDER AND CONDUCTIVE COMPOSITION INCLUDING THE SAME
PROBLEM TO BE SOLVED: To provide a powder comprising copper as a base material that can increase the conductivity of a conductor formed from a conductive composition.SOLUTION: The composite copper powder has a composite copper particle including a base material copper particle and a silver-containin...
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Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a powder comprising copper as a base material that can increase the conductivity of a conductor formed from a conductive composition.SOLUTION: The composite copper powder has a composite copper particle including a base material copper particle and a silver-containing complex compound present on the surface of the base material copper particle. The base material copper particle has a core material particle of copper and a silver-coated copper particle having a coating layer of silver present on the surface of the core material particle. The silver-containing complex compound has a complex compound of a carboxylate of silver and an amine compound and preferably, the silver-containing complex compound comprises a complex compound of a 1-5C carboxylate of silver and a saturated or unsaturated aliphatic amine.SELECTED DRAWING: None
【課題】導電性組成物から形成された導電体の導電性を高くし得る、銅を母材とする粉を提供すること。【解決手段】本発明の複合銅粉は、母材銅粒子と、該母材銅粒子の表面に存在する銀含有錯化合物とを含む複合銅粒子を有する。母材銅粒子は、銅の芯材粒子、及び該芯材粒子の表面に存在する銀の被覆層を有する銀コート銅粒子を有する。銀含有錯化合物は、銀のカルボン酸塩とアミン化合物との錯化合物を有する。銀含有錯化合物は、1以上5以下の炭素数の銀のカルボン酸塩と、飽和又は不飽和脂肪族アミンとの錯化合物からなることが好適である。【選択図】なし |
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