LEAD FRAME FOR LIGHT-EMITTING ELEMENT MOUNTING, RESIN MOLDED BODY FOR LIGHT-EMITTING ELEMENT MOUNTING USING THE SAME, AND SURFACE-MOUNTED LIGHT-EMITTING DEVICE
PROBLEM TO BE SOLVED: To provide a lead frame for light-emitting element mounting which is easy to handle, can also be set to a metal mold with high workability in the case of molding, has such flexure rigidity as not to be easily cracked even if an external force of warpage of flexure is applied af...
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Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a lead frame for light-emitting element mounting which is easy to handle, can also be set to a metal mold with high workability in the case of molding, has such flexure rigidity as not to be easily cracked even if an external force of warpage of flexure is applied after molding, improves a degree of freedom in design such as the kind of a metal mold or a resin for molding a resin layer or a molding condition, facilitates handling after extraction from the metal mold, mounting of a light-emitting element or cutting work in dicing and can improve production efficiency, a resin molded body using the same and a light-emitting device.SOLUTION: A connection structure S is provided by connecting a unit mounting region 1A in which a first lead 21 and a second lead 22 are arranged side by side in a horizontal direction, and a unit mounting region 1B in a form where the unit mounting region 1A is rotated at 90 degrees and in a form where the leads 21 and 22 are arranged side by side in a vertical direction, with each other via a connection part 3.SELECTED DRAWING: Figure 1
【課題】取扱い容易であり、成形時の金型へのセットも作業性よく行うことができ、成形後に反りや曲げの外力が加わっても容易に割れることがない曲げ強度を備え、樹脂層を成形する金型や樹脂の種類、成型条件などの設計の自由度を高め、金型から取り出した後の取り扱いや発光素子の実装、個片化の際の切断作業なども容易となり、生産効率の向上が可能な発光素子実装用リードフレーム、これを用いた樹脂成型体及び発光装置を提供せんとする。【解決手段】第1のリード21、第2のリード22が横方向に並んだ単位実装領域1Aと、これを90度回転させた形態でリード21、22が縦方向に並んだ形態の単位実装領域1Bとを連結部3を介して互いに連結した連結構造Sを設けた。【選択図】図1 |
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