MULTILAYER SUBSTRATE, FLEXIBLE SUBSTRATE, RIGID-FLEXIBLE SUBSTRATE, PRINTED CIRCUIT BOARD, SEMICONDUCTOR PACKAGE BOARD, SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE, INFORMATION PROCESSING MODULE, COMMUNICATION MODULE, INFORMATION PROCESSING DEVICE, AND COMMUNICATION DEVICE

PROBLEM TO BE SOLVED: To provide a multilayer substrate, a semiconductor package, a semiconductor device, an information processing device, and a communication device that can reduce radiation noise and improve resistance to spatial noise.SOLUTION: A multilayer substrate comprises: a ground layer 30...

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Bibliographische Detailangaben
1. Verfasser: YAMAGISHI KEITARO
Format: Patent
Sprache:eng ; jpn
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