INTEGRALLY MOLDED PRODUCT OF ELECTRONIC DEVICE AND RESIN

PROBLEM TO BE SOLVED: To provide an integrally molded product of an electronic device and resin, which does not easily become dusty on the edges of the electronic device and contributes to reduction of weight, thickness, and cost of an electronic product.SOLUTION: There is provided an integrally-mol...

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Bibliographische Detailangaben
Hauptverfasser:	KOGANEZAWA KOJI, MORI MINEO, TAKIGAWA JUMPEI, NAGAMURA EITA, SHIRATORI SATOSHI, NAKAJIMA RYOTA
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ADVERTISING CRYPTOGRAPHY DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING DISPLAY DISPLAYING EDUCATION FREQUENCY-CHANGING LABELS OR NAME-PLATES NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS SEALS SIGNS TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an integrally molded product of an electronic device and resin, which does not easily become dusty on the edges of the electronic device and contributes to reduction of weight, thickness, and cost of an electronic product.SOLUTION: There is provided an integrally-molded product of an electronic device and resin, in which an electronic device and resin are integrally molded. The integrally-molded product includes an electronic device and resin around the electronic device, the electronic device having an electronic device main surface forming an outer surface of the electronic device and an electronic device side surface leading to the main surface, and the resin product having a resin main surface at the same level as the electronic device main surface and a resin side surface leading to the resin main surface and in contact with the electronic device side surface.SELECTED DRAWING: Figure 14 【課題】電子デバイスの縁にホコリやチリがたまりにくく、電気製品の軽量化や薄型化、低コスト化に寄与する電子デバイス樹脂一体成形品を提供する。【解決手段】電子デバイスと樹脂成形体とが一体成形された電子デバイス樹脂一体成形品であって、該電子デバイス樹脂一体成形品は、該電子デバイスの周囲に該樹脂成形体が配置され、該電子デバイスは、該電子デバイスの外面を形成する電子デバイス主面と、該電子デバイス主面に連なる電子デバイス側面とを有し、該樹脂成形体は、該電子デバイス主面と面一の樹脂主面と、該樹脂主面に連なり該電子デバイス側面に当接する樹脂側面とを有する、電子デバイス樹脂一体成形品である。【選択図】図１４