PREPREG, METAL-CLAD LAMINATE AND PRINTED WIRING BOARD

PROBLEM TO BE SOLVED: To provide a prepreg capable of controlling resin flow performance, to provide a metal-clad laminate and to provide a printed wiring board.SOLUTION: The prepreg is formed by impregnating a resin composition in a woven fabric substrate and heating/drying. The resin composition i...

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Bibliographische Detailangaben
Hauptverfasser:	SUZUKI FUMITO, YONEMOTO TATSUO, FUJINO KENTARO, MIDORIKAWA HIROFUMI, MITO TAKATOSHI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON GENERAL PROCESSES OF COMPOUNDING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a prepreg capable of controlling resin flow performance, to provide a metal-clad laminate and to provide a printed wiring board.SOLUTION: The prepreg is formed by impregnating a resin composition in a woven fabric substrate and heating/drying. The resin composition includes as an inorganic filler either one of spherical silica surface-treated with isocyanate silane and spherical silica surface-treated with epoxysilane.SELECTED DRAWING: None 【課題】樹脂流れ性を調整可能とするプリプレグ、金属張積層板、プリント配線板を提供することを目的とする。【解決手段】樹脂組成物を織布基材に含浸させ、加熱乾燥して形成されるプリプレグであって、前記樹脂組成物が、無機充填材として、イソシアネートシランで表面処理された球状シリカ、または、エポキシシランで表面処理された球状シリカのいずれか一方を含む、プリプレグ。【選択図】なし