LAMINATED FILM FOR SURFACE COATING OF RESIN MOLDING, AND RESIN MOLDING

PROBLEM TO BE SOLVED: To provide a laminated film for surface coating of a resin molding capable of suppressing generation of crack, whitening and film exfoliation at the heating molding time, and further suppressing scratch.SOLUTION: There is provided a laminated film for surface coating of a resin...

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Bibliographische Detailangaben
Hauptverfasser:	ISHIHARA TAKESHI, KANESASHI YOSHIHISA, OZEKI IPPEI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a laminated film for surface coating of a resin molding capable of suppressing generation of crack, whitening and film exfoliation at the heating molding time, and further suppressing scratch.SOLUTION: There is provided a laminated film for surface coating of a resin molding having a self-repairable resin layer on a base material film. In the laminated film for surface coating of the resin molding, a stress at the 100% elongation time at 160°C of the base material film is 40 MPa or less, and a tensile elongation at 160°C of the laminated film for surface coating is 40% or more.SELECTED DRAWING: Figure 3 【課題】加熱成型時におけるクラック、白化および膜剥がれの発生を抑制し、かつ傷付きを抑制することができる、樹脂成型品の表面被覆用積層フィルムを提供する。【解決手段】基材フィルム上に自己修復性樹脂層を有する樹脂成型品の表面被覆用積層フィルムであって、前記基材フィルムが１６０℃における１００％伸長時の応力が４０ＭＰａ以下であり、表面被覆用積層フィルムの１６０℃における引張伸度が４０％以上であることを特徴とする、樹脂成型品の表面被覆用積層フィルム。【選択図】図３